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Process Transferability from a Spot Beam to a Ribbon Beam Implanter: CMOS Device Matching
Process Transferability from a Spot Beam to a Ribbon Beam Implanter: CMOS Device Matching

An effective Failure Analysis Strategy for the successful introduction of new products designed in 90 and 65 nm CMOS technologie
An effective Failure Analysis Strategy for the successful introduction of new products designed in 90 and 65 nm CMOS technologie

ALTERNANCE STMicroelectronics Crolles
ALTERNANCE STMicroelectronics Crolles

Polar Gaussian Processes for Predicting on Circular Domains
Polar Gaussian Processes for Predicting on Circular Domains

PDF) DSA planarization approach to solve pattern density issue
PDF) DSA planarization approach to solve pattern density issue

Gold Wire Bonding Induced Peeling in Cu/Low-k Interconnects: 3D Simulation and Correlations.
Gold Wire Bonding Induced Peeling in Cu/Low-k Interconnects: 3D Simulation and Correlations.

Crolles 1 et Crolles 2
Crolles 1 et Crolles 2

STMICROELECTRONICS SA Crolles (Crolles, Auvergne-Rhône-Alpes)
STMICROELECTRONICS SA Crolles (Crolles, Auvergne-Rhône-Alpes)

STMICROELECTRONICS - 850 Rue Jean Monnet, Crolles, Isère, France - Phone Number - Yelp
STMICROELECTRONICS - 850 Rue Jean Monnet, Crolles, Isère, France - Phone Number - Yelp

Benefits of XPS nanocharacterization for process development and industrial control of thin SiGe channel layers in advanced CMOS
Benefits of XPS nanocharacterization for process development and industrial control of thin SiGe channel layers in advanced CMOS

Crolles 1 et Crolles 2
Crolles 1 et Crolles 2

L-shaped fiber-chip grating couplers with high directionality and low reflectivity fabricated with deep-UV lithography
L-shaped fiber-chip grating couplers with high directionality and low reflectivity fabricated with deep-UV lithography

Sample manuscript showing specifications and style
Sample manuscript showing specifications and style

arXiv:1504.01881v1 [cond-mat.mtrl-sci] 8 Apr 2015
arXiv:1504.01881v1 [cond-mat.mtrl-sci] 8 Apr 2015

PDF) Electron BackScattered Diffraction (EBSD) use and applications in newest technologies development | C. Wyon - Academia.edu
PDF) Electron BackScattered Diffraction (EBSD) use and applications in newest technologies development | C. Wyon - Academia.edu

▷ Stmicroelectronics, Crolles
▷ Stmicroelectronics, Crolles

RECENT DEVELOPMENTS ON 3D INTEGRATION OF METALLIC SET ONTO CMOS PROCESS FOR MEMORY APPLICATION
RECENT DEVELOPMENTS ON 3D INTEGRATION OF METALLIC SET ONTO CMOS PROCESS FOR MEMORY APPLICATION

COMPARING TRANSPORT POLICIES IN A FULL-SCALE 300MM WAFER MANUFACTURING FACILITY J.-E. Kiba, S. Dauzère-Pérès, C. Yugma Ecole
COMPARING TRANSPORT POLICIES IN A FULL-SCALE 300MM WAFER MANUFACTURING FACILITY J.-E. Kiba, S. Dauzère-Pérès, C. Yugma Ecole

PDF) Three-dimensional broadband FDTD optical simulations of CMOS image sensor
PDF) Three-dimensional broadband FDTD optical simulations of CMOS image sensor

STMICROELECTRONICS (CROLLES 2) SAS (CROLLES) Chiffre d'affaires, résultat, bilans sur SOCIETE.COM - 399395581
STMICROELECTRONICS (CROLLES 2) SAS (CROLLES) Chiffre d'affaires, résultat, bilans sur SOCIETE.COM - 399395581

ACCORD D'ENTREPRISE RELATIF A L'INTERESSEMENT DES SALARIES AUX RESULTATS DE L'ENTREPRISE
ACCORD D'ENTREPRISE RELATIF A L'INTERESSEMENT DES SALARIES AUX RESULTATS DE L'ENTREPRISE

Assessment and Characterization of Stress Induced by Via-First TSV Technology
Assessment and Characterization of Stress Induced by Via-First TSV Technology

Quantitative Strain Measurement in Sub-45 nm CMOS Transistors by Convergent Beam Electron Diffraction (CBED) at Low Temperature
Quantitative Strain Measurement in Sub-45 nm CMOS Transistors by Convergent Beam Electron Diffraction (CBED) at Low Temperature

Dealing With Multiple Grains in TEM Lamellae Thickness for Microstructure Analysis Using Scanning Precession Electron Diffraction | Microscopy and Microanalysis | Cambridge Core
Dealing With Multiple Grains in TEM Lamellae Thickness for Microstructure Analysis Using Scanning Precession Electron Diffraction | Microscopy and Microanalysis | Cambridge Core

hal-00198681, v1] LusSy: A toolbox for the analysis of systems-on-a-chip at the transactional level
hal-00198681, v1] LusSy: A toolbox for the analysis of systems-on-a-chip at the transactional level

Process Architecture for Spatial and Temporal Variability Improvement of SRAM Circuits at the 45nm node B-7-2
Process Architecture for Spatial and Temporal Variability Improvement of SRAM Circuits at the 45nm node B-7-2